- メーカー：
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- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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| 画像 | 部 | メーカー | 説明 | MOQ | ストック | アクション | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1 |
3,000
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 1 |
1,577
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 1 |
1,582
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
65
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
72
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
37
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 10 |
6,500
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 10 |
6,500
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 10 |
6,500
In-stock
|
見積もりを取る |