- メーカー：
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- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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11 記録
| 画像 | 部 | メーカー | 説明 | MOQ | ストック | アクション | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | 1 |
620
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
541
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
38
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
93
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
34
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
14
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
6,500
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 10 |
6,500
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 10 |
6,500
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 10 |
6,500
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 500 |
6,500
In-stock
|
見積もりを取る |