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Power Dissipation @ Temperature Rise:
Product Status:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
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HSE-B20250-045H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 50
1
14
In-stock
見積もりを取る
HSB21-454515 CUI Devices
HEAT SINK, BGA, 45 X 45 X 15 MM
1
6,500
In-stock
見積もりを取る
CR101-25AE Ohmite
ALUMINUM HEATSINK 25MM BLK ANODI
1
6,500
In-stock
見積もりを取る
CR201-25AE Ohmite
ALUMINUM HEATSINK 25MM BLK ANODI
1
6,500
In-stock
見積もりを取る
BGAH170-075E Ohmite
BGA HEATSINK W/TAPE
1
6,500
In-stock
見積もりを取る
CR201-75AE Ohmite
ALUMINUM HEATSINK 75MM BLK ANODI
1
6,500
In-stock
見積もりを取る
114070162 Seeed
ALUMINUM ALLOY CNC HEAT SINK WIT
1
1
In-stock
見積もりを取る
CR201-25VE Ohmite
ALUMINUM HEATSINK 25MM DEGREASED
1
6,500
In-stock
見積もりを取る
WAVE-35-12 Wakefield Thermal
ANCHOR HEATSINK 35X35X12MM
1
6,500
In-stock
見積もりを取る
CR101-75VE Ohmite
ALUMINUM HEATSINK 75MM DEGREASED
1
6,500
In-stock
見積もりを取る
CR401-50VE Ohmite
ALUMINUM HEATSINK 50MM DEGREASED
1
5
In-stock
見積もりを取る
BGAH325-075E Ohmite
BGA HEATSINK W/TAPE
1
2
In-stock
見積もりを取る
CR401-75VE Ohmite
ALUMINUM HEATSINK 75MM DEGREASED
1
22
In-stock
見積もりを取る
HSF-50-40-Y-F Wakefield Thermal
FANSINK 5VDC 50X50X39.5MM
1
5
In-stock
見積もりを取る
HSF-55-45-Y-F Wakefield Thermal
FANSINK 12VDC 55X55X45.1MM
1
5
In-stock
見積もりを取る
HSB01-080808 CUI Devices
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
1
6,500
In-stock
見積もりを取る
HSS14-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-220, 19.
1
6,500
In-stock
見積もりを取る
HSB04-171706 CUI Devices
HEAT SINK, BGA, 17 X 17 X 6 MM
1
6,500
In-stock
見積もりを取る
HSB07-202009 CUI Devices
HEAT SINK, BGA, 20 X 20 X 9 MM
1
6,500
In-stock
見積もりを取る
HSE-B20350-NP CUI Devices
HEAT SINK, EXTRUSION, TO-220, 35
1
6,500
In-stock
見積もりを取る
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