メーカー:
  • (1)
  • (1)
  • (50)
  • (229)
  • (120)
  • (3)
  • (21)
  • (19)
  • (58)
  • (3)
  • (91)
Power Dissipation @ Temperature Rise:
Product Status:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
画像 メーカー 説明 MOQ ストック アクション
HSE-B20635-035H-W CUI Devices
HEAT SINK, EXTRUSION, TO-220, 63
1,800
6,500
In-stock
見積もりを取る
HSE-B630-04H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 63
1,200
6,500
In-stock
見積もりを取る
HSE-B18381-0396H CUI Devices
HEAT SINK, EXTRUSION, TO-218, 38
1,350
6,500
In-stock
見積もりを取る
HSE-B18254-060H-W CUI Devices
HEAT SINK, EXTRUSION, TO-218, 25
1,500
6,500
In-stock
見積もりを取る
HSE-B18635-035H CUI Devices
HEAT SINK, EXTRUSION,TO-218, 63.
1,200
6,500
In-stock
見積もりを取る
HSE-B18635-035H-04 CUI Devices
HEAT SINK, EXTRUSION, TO-218, 63
1,200
6,500
In-stock
見積もりを取る
HSE-B635-045H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 63
1,350
6,500
In-stock
見積もりを取る
V2201N1-F-LP ASSMANN WSW Components
HEATSINK CPU W/ADHESIVE STAMPED
480
6,500
In-stock
見積もりを取る
HSE-B18635-060H-W CUI Devices
HEAT SINK, EXTRUSION, TO-218, 63
1,200
6,500
In-stock
見積もりを取る
HSE-B18508-060H-W CUI Devices
HEAT SINK, EXTRUSION,TO-218, 50.
1,350
6,500
In-stock
見積もりを取る
HSE-B18318-0396H CUI Devices
HEAT SINK, EXTRUSION,TO-218, 31.
1,350
6,500
In-stock
見積もりを取る
HSE-B18508-0396H CUI Devices
HEAT SINK, EXTRUSION, TO-218, 50
1,200
6,500
In-stock
見積もりを取る
HSE-B18635-0396H CUI Devices
HEAT SINK, EXTRUSION, TO-218, 63
1,200
6,500
In-stock
見積もりを取る
CR301-25AE Ohmite
ALUMINUM HEATSINK 25MM BLK ANODI
100
6,500
In-stock
見積もりを取る
621A Wakefield Thermal
HEATSINK FOR TO3
250
6,500
In-stock
見積もりを取る
621K Wakefield Thermal
HEATSINK FOR TO3
250
6,500
In-stock
見積もりを取る
AER19-19-12CB/A01 CTS Corporation
HEATSINK FORGED BLK ANO TOP MNT
300
6,500
In-stock
見積もりを取る
AER19-19-15CB/A01 CTS Corporation
HEATSINK FORGED BLK ANO TOP MNT
300
6,500
In-stock
見積もりを取る
AER19-19-18CB/A01 CTS Corporation
HEATSINK FORGED BLK ANO TOP MNT
300
6,500
In-stock
見積もりを取る
AER21-21-12CB/A01 CTS Corporation
HEATSINK FORGED BLK ANO TOP MNT
300
6,500
In-stock
見積もりを取る
15 / 30 Page, 596 Records