- メーカー：
-
- Attachment Method：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Shape：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
596 記録
| 画像 | 部 | メーカー | 説明 | MOQ | ストック | アクション | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | 1 |
933
In-stock
|
見積もりを取る | |||
|
|
Wakefield Thermal | 1 |
884
In-stock
|
見積もりを取る | |||
|
|
Wakefield Thermal | 1 |
1,005
In-stock
|
見積もりを取る | |||
|
|
Wakefield Thermal | 1 |
192
In-stock
|
見積もりを取る | |||
|
|
Wakefield Thermal | 1 |
142
In-stock
|
見積もりを取る | |||
|
|
Wakefield Thermal | 1 |
977
In-stock
|
見積もりを取る | |||
|
|
Wakefield Thermal | 1 |
504
In-stock
|
見積もりを取る | |||
|
|
Wakefield Thermal | 1 |
684
In-stock
|
見積もりを取る | |||
|
|
Wakefield Thermal | 1 |
191
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 1 |
3,000
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 1 |
2,000
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 1 |
2,987
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 1 |
2,355
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 1 |
2,657
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 1 |
1,358
In-stock
|
見積もりを取る | |||
|
|
ASSMANN WSW Components | 1 |
1,713
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 1 |
3,000
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 1 |
2,577
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 1 |
2,713
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 1 |
2,870
In-stock
|
見積もりを取る |