- メーカー:
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- Attachment Method:
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- Material Finish:
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- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Shape:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
-
596 記録
画像 | 部 | メーカー | 説明 | MOQ | ストック | アクション | |
---|---|---|---|---|---|---|---|
CUI Devices | 1 |
2,500
In-stock
|
見積もりを取る | ||||
NTE Electronics, Inc. | 1 |
1,312
In-stock
|
見積もりを取る | ||||
ASSMANN WSW Components | 1 |
2,562
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
2,992
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
2,215
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
4,828
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
1,194
In-stock
|
見積もりを取る | ||||
NTE Electronics, Inc. | 1 |
172
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
1,606
In-stock
|
見積もりを取る | ||||
ASSMANN WSW Components | 1 |
1,334
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
1,977
In-stock
|
見積もりを取る | ||||
NTE Electronics, Inc. | 1 |
1,448
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
1,704
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
1,577
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
1,202
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
3,230
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
1,542
In-stock
|
見積もりを取る | ||||
ASSMANN WSW Components | 1 |
1,035
In-stock
|
見積もりを取る | ||||
ASSMANN WSW Components | 1 |
1,315
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
1,582
In-stock
|
見積もりを取る |