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Power Dissipation @ Temperature Rise:
Product Status:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
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HSS27-B20-P43 CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
1
2,500
In-stock
見積もりを取る
NTE496 NTE Electronics, Inc.
HEATSINK FOR PLASTIC PWR
1
1,312
In-stock
見積もりを取る
V2268E1 ASSMANN WSW Components
CPU HEATSINK, CROSS CUT, AL6063,
1
2,562
In-stock
見積もりを取る
HSS24-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
1
2,992
In-stock
見積もりを取る
HSS11-B20-P38 CUI Devices
HEAT SINK, STAMPING, TO-220, 50.
1
2,215
In-stock
見積もりを取る
HSS15-B20-P40 CUI Devices
HEAT SINK, STAMPING, TO-220, 23.
1
4,828
In-stock
見積もりを取る
HSB26-343408 CUI Devices
HEAT SINK, BGA, 33.5 X 33.5 X 8
1
1,194
In-stock
見積もりを取る
NTE402 NTE Electronics, Inc.
HEAT SINK-PLAST. PWR TRAN
1
172
In-stock
見積もりを取る
HSS02-B20-P318 CUI Devices
HEAT SINK, STAMPING, TO-220, 23.
1
1,606
In-stock
見積もりを取る
V2277E1 ASSMANN WSW Components
CPU HEATSINK, CROSS CUT, AL6063,
1
1,334
In-stock
見積もりを取る
HSS04-B20-P318 CUI Devices
HEAT SINK, STAMPING, TO-220, 41.
1
1,977
In-stock
見積もりを取る
NTE497 NTE Electronics, Inc.
HEATSINK FOR TO-220
1
1,448
In-stock
見積もりを取る
HSB25-282810 CUI Devices
HEAT SINK, BGA, 28.5 X 28.5 X 10
1
1,704
In-stock
見積もりを取る
HSE01-193175 CUI Devices
HEAT SINK, EXTRUSION, 19 X 31.5
1
1,577
In-stock
見積もりを取る
HSB23-232325 CUI Devices
HEAT SINK, BGA, 23 X 23 X 25 MM
1
1,202
In-stock
見積もりを取る
HSE05-171933 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
3,230
In-stock
見積もりを取る
HSE02-173213 CUI Devices
HEAT SINK, EXTRUSION, 17 X 31.9
1
1,542
In-stock
見積もりを取る
V2270E1 ASSMANN WSW Components
CPU HEATSINK, CROSS CUT, AL6063,
1
1,035
In-stock
見積もりを取る
V2275E1 ASSMANN WSW Components
CPU HEATSINK, CROSS CUT, AL6063,
1
1,315
In-stock
見積もりを取る
HSE01-193175P CUI Devices
HEAT SINK, EXTRUSION, 19 X 31.5
1
1,582
In-stock
見積もりを取る
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