- メーカー:
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- Attachment Method:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Shape:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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596 記録
画像 | 部 | メーカー | 説明 | MOQ | ストック | アクション | |
---|---|---|---|---|---|---|---|
NTE Electronics, Inc. | 1 |
306
In-stock
|
見積もりを取る | ||||
ASSMANN WSW Components | 1 |
1,500
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
1,197
In-stock
|
見積もりを取る | ||||
NTE Electronics, Inc. | 1 |
532
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
1,118
In-stock
|
見積もりを取る | ||||
ASSMANN WSW Components | 1 |
1,499
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
1,081
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
1,572
In-stock
|
見積もりを取る | ||||
NTE Electronics, Inc. | 1 |
270
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
992
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
999
In-stock
|
見積もりを取る | ||||
ASSMANN WSW Components | 1 |
1,449
In-stock
|
見積もりを取る | ||||
NTE Electronics, Inc. | 3 |
232
In-stock
|
見積もりを取る | ||||
NTE Electronics, Inc. | 1 |
1,072
In-stock
|
見積もりを取る | ||||
NTE Electronics, Inc. | 1 |
26
In-stock
|
見積もりを取る | ||||
ASSMANN WSW Components | 1 |
796
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
605
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
960
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
780
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
646
In-stock
|
見積もりを取る |