- メーカー:
-
- Attachment Method:
-
- Material Finish:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Shape:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
画像 | 部 | メーカー | 説明 | MOQ | ストック | アクション | |
---|---|---|---|---|---|---|---|
CUI Devices | 1 |
2,893
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
2,208
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
1,944
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
1,262
In-stock
|
見積もりを取る | ||||
Ohmite | 1 |
3,194
In-stock
|
見積もりを取る | ||||
Ohmite | 1 |
1,499
In-stock
|
見積もりを取る | ||||
Ohmite | 1 |
126
In-stock
|
見積もりを取る | ||||
Ohmite | 1 |
146
In-stock
|
見積もりを取る | ||||
Ohmite | 1 |
129
In-stock
|
見積もりを取る | ||||
Ohmite | 1 |
230
In-stock
|
見積もりを取る | ||||
Ohmite | 1 |
625
In-stock
|
見積もりを取る | ||||
Ohmite | 1 |
196
In-stock
|
見積もりを取る | ||||
Ohmite | 1 |
107
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
3,000
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
2,870
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
2,500
In-stock
|
見積もりを取る | ||||
NTE Electronics, Inc. | 1 |
1,312
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
2,215
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
4,828
In-stock
|
見積もりを取る | ||||
CUI Devices | 1 |
1,606
In-stock
|
見積もりを取る |