- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
| 画像 | 部 | メーカー | 説明 | MOQ | ストック | アクション | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1 |
1,577
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 1 |
1,542
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 1 |
1,582
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 1 |
1,572
In-stock
|
見積もりを取る |