Power Dissipation @ Temperature Rise:
Product Status:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
173 記録
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HSS-B20-0635H-01 CUI Devices
HEATSINK TO-220 2.7W ALUMINUM
1
1,923
In-stock
見積もりを取る
HSE-B2111-038 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
1
15,288
In-stock
見積もりを取る
HSS-B20-NP-12 CUI Devices
HEATSINK TO-220 6.8W ALUMINUM
1
1,393
In-stock
見積もりを取る
HSB02-101007 CUI Devices
HEAT SINK, BGA, 10 X 10 X 7 MM
1
3,205
In-stock
見積もりを取る
HSB03-141406 CUI Devices
HEAT SINK, BGA, 14 X 14 X 6 MM
1
3,326
In-stock
見積もりを取る
HSB10-232306 CUI Devices
HEAT SINK, BGA, 23 X 23 X 6 MM
1
1,287
In-stock
見積もりを取る
HSB12-272706 CUI Devices
HEAT SINK, BGA, 27 X 27 X 6 MM
1
1,713
In-stock
見積もりを取る
HSS10-B20-P40 CUI Devices
HEAT SINK, STAMPING, TO-220, 29.
1
2,893
In-stock
見積もりを取る
HSB03-121218 CUI Devices
HEAT SINK, BGA, 12 X 12 X 18 MM
1
1,689
In-stock
見積もりを取る
HSB18-232310 CUI Devices
HEAT SINK, BGA, 23 X 23 X 10 MM
1
5,589
In-stock
見積もりを取る
HSE-B250-04H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
1
2,208
In-stock
見積もりを取る
HSS03-B20-P318 CUI Devices
HEAT SINK, STAMPING, TO-220, 41.
1
1,944
In-stock
見積もりを取る
HSB11-252518 CUI Devices
HEAT SINK, BGA, 25 X 25 X 18 MM
1
1,433
In-stock
見積もりを取る
HSS01-B20-CP CUI Devices
HEAT SINK, STAMPING, TO-220, 49.
1
1,262
In-stock
見積もりを取る
HSB16-404018 CUI Devices
HEAT SINK, BGA, 40 X 40 X 18 MM
1
1,250
In-stock
見積もりを取る
HSB17-404025 CUI Devices
HEAT SINK, BGA, 40 X 40 X 25 MM
1
6,500
In-stock
見積もりを取る
HSS-B20-065V-02 CUI Devices
HEATSINK TO-220 2.9W ALUMINUM
1
1,774
In-stock
見積もりを取る
HSS-B20-061H CUI Devices
HEATSINK TO-220 4W ALUMINUM
1
2,121
In-stock
見積もりを取る
HSE10-B20-NP CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
3,000
In-stock
見積もりを取る
HSE12-B20-NP CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
2,000
In-stock
見積もりを取る
1 / 9 Page, 173 Records