Size / Dimension:
Storage/Refrigeration Temperature:
Thermal Conductivity:
Usable Temperature Range:
Image Part Manufacturer Description MOQ Stock Action
HSC67-6G CAIG Laboratories, Inc.
SILICONE HEAT SINK COMPOUND SQUE
1
55
In-stock
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8329-350G MG Chemicals
EPOXY MOLD RELEASE (NON SILICONE
12
6,500
In-stock
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