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Fans, Thermal Management
Thermal - Heat Sinks
Attachment Method：
Solder Anchor
(1)
Thermal Tape, Adhesive (Included)
(1)
Power Dissipation @ Temperature Rise：
1.5W @ 50°C
(1)
3.0W @ 90°C
(1)
Thermal Resistance @ Forced Air Flow：
6.00°C/W @ 500 LFM
(1)
9.30°C/W @ 200 LFM
(1)
Filter：
Thermal - Heat Sinks
Package Cooled : BGA, FPGA
2 Records
Image
Part
Manufacturer
Description
MOQ
Stock
Action
374324B00035G
Aavid
HEATSINK BGA W/ADHESIVE TAPE
1
PDF
1,296
In-stock
Get Quote
374324B60023G
Aavid
BGA HEAT SINK
1
PDF
4,302
In-stock
Get Quote
374324B00035G
Aavid
HEATSINK BGA W/ADHESIVE TAPE
Stock : 1,296
RFQ
374324B60023G
Aavid
BGA HEAT SINK
Stock : 4,302
RFQ
1 / 1 Page, 2 Records
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