- Manufacturer:
-
- Brainboxes (1)
- DFRobot (1)
- Seeed (5)
- Attachment Method:
-
- Material Finish:
-
- Power Dissipation @ Temperature Rise:
-
- Product Status:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
10 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Seeed | 1 |
1,324
In-stock
|
Get Quote | |||
![]() |
OSEPP Electronics | 7 |
605
In-stock
|
Get Quote | |||
![]() |
OSEPP Electronics | 5 |
565
In-stock
|
Get Quote | |||
![]() |
OSEPP Electronics | 2 |
205
In-stock
|
Get Quote | |||
![]() |
Seeed | 1 |
22
In-stock
|
Get Quote | |||
![]() |
DFRobot | 1 |
6,500
In-stock
|
Get Quote | |||
![]() |
Seeed | 1 |
1
In-stock
|
Get Quote | |||
![]() |
Brainboxes | 1 |
24
In-stock
|
Get Quote | |||
![]() |
Seeed | 1 |
6,500
In-stock
|
Get Quote | |||
![]() |
Seeed | 1 |
6,500
In-stock
|
Get Quote |