Attachment Method:
Material Finish:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSS05-C20-SMT-TR CUI Devices
HEAT SINK, STAMPING, TO-220, 12.
1
1,957
In-stock
Get Quote
HSS-B20-NP-07 CUI Devices
HEATSINK TO-220 2.3W ALUMINUM
1
129
In-stock
Get Quote
HSS-B20-0953H-01 CUI Devices
HEATSINK TO-220 2.3W ALUMINUM
128
6,500
In-stock
Get Quote
HSS-B20-061H-01 CUI Devices
HEATSINK TO-220 2.3W ALUMINUM
3,000
6,500
In-stock
Get Quote
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