Image Part Manufacturer Description MOQ Stock Action
HSS03-B20-P318 CUI Devices
HEAT SINK, STAMPING, TO-220, 41.
1
1,944
In-stock
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HSB11-252518 CUI Devices
HEAT SINK, BGA, 25 X 25 X 18 MM
1
1,433
In-stock
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HSE-B20250-040H-01 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
1
605
In-stock
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HSE-B20254-056H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
33
6,500
In-stock
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HSE-B20254-035H-02 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
1,500
6,500
In-stock
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