Package Cooled:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSS04-B20-P318 CUI Devices
HEAT SINK, STAMPING, TO-220, 41.
1
1,977
In-stock
Get Quote
HSE-B381-04H CUI Devices
HEAT SINK, EXTRUSION, TO-220/TO-
1,000
6,500
In-stock
Get Quote
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