- Attachment Method：
-
- Material：
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- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
3 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 5,400 |
6,500
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1,500 |
6,500
In-stock
|
Get Quote | |||
|
|
CUI Devices | 500 |
6,500
In-stock
|
Get Quote |