- Manufacturer:
-
- CUI Devices (4)
- Ohmite (10)
- Wakefield Thermal (15)
- Attachment Method:
-
- Material Finish:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
29 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Ohmite | 1 |
221
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 1 |
829
In-stock
|
Get Quote | |||
![]() |
Ohmite | 1 |
150
In-stock
|
Get Quote | |||
![]() |
Ohmite | 1 |
167
In-stock
|
Get Quote | |||
![]() |
Ohmite | 1 |
520
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 1 |
933
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 1 |
884
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 1 |
1,005
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 1 |
192
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 1 |
142
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 1 |
977
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 1 |
504
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 1 |
684
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 1 |
191
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
1,577
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
1,542
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
1,582
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
1,572
In-stock
|
Get Quote | |||
![]() |
Ohmite | 1 |
98
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 1 |
312
In-stock
|
Get Quote |