Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSB10-232306 CUI Devices
HEAT SINK, BGA, 23 X 23 X 6 MM
1
1,287
In-stock
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HSB08-212106 CUI Devices
HEAT SINK, BGA, 21 X 21 X 6 MM
1
6,500
In-stock
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