- Manufacturer：
-
- CUI Devices (1)
- Attachment Method：
-
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Type：
-
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1 |
3,326
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
128
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
1,000
In-stock
|
Get Quote |