Manufacturer:
Attachment Method:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE-B18635-035H CUI Devices
HEAT SINK, EXTRUSION,TO-218, 63.
1,200
6,500
In-stock
Get Quote
HSE-B18635-060H-W CUI Devices
HEAT SINK, EXTRUSION, TO-218, 63
1,200
6,500
In-stock
Get Quote
907-33-2-28-2-B-0 Wakefield Thermal
HEAT SINK PIN FIN 33X33MM CLIP
180
6,500
In-stock
Get Quote
1 / 1 Page, 3 Records