Attachment Method:
Material Finish:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE-B20250-040H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
1,500
6,500
In-stock
Get Quote
2-1963552-5 TE Connectivity AMP Connectors
5 FINS, 2.000 OD HS W/2 LEGS, 23
1
6,500
In-stock
Get Quote
2-1963553-5 TE Connectivity AMP Connectors
5 FINS, 2.000 OD HS W/4 LEGS,
1
6,500
In-stock
Get Quote
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