Manufacturer:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSB25-282810 CUI Devices
HEAT SINK, BGA, 28.5 X 28.5 X 10
1
1,704
In-stock
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APR21-21-23CB/A01 CTS Corporation
HEATSINK FORGED BLK ANO TOP MNT
300
6,500
In-stock
Get Quote
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