Attachment Method:
Material:
Material Finish:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
ATS-PCB1061 Advanced Thermal Solutions, Inc.
HEATSINK TRIPLE TO-126 COPPER
1
7,993
In-stock
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HSS-B20-095H CUI Devices
HEATSINK TO-220 4.1W ALUMINUM
1
333
In-stock
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