Thermal - Heat Sinks - MUC-CHIP

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7 Records

Image	Part	Manufacturer	Description	MOQ		Stock	Action
	HSB18-232310	CUI Devices	HEAT SINK, BGA, 23 X 23 X 10 MM	1	PDF	5,589 In-stock	Get Quote
	960-19-15-F-AB-0	Wakefield Thermal	HEATSINK 19X15MM FRONT PUSH PIN	1	PDF	225 In-stock	Get Quote
	960-19-15-S-AB-0	Wakefield Thermal	HEATSINK 19X15MM SIDE PUSH PIN	1	PDF	89 In-stock	Get Quote
	960-19-15-D-AB-0	Wakefield Thermal	HEATSINK 19X15MM DIA PUSH PIN	1	PDF	6,500 In-stock	Get Quote
	960-23-12-F-AB-0	Wakefield Thermal	HEATSINK 23X12MM FRONT PUSH PIN	1	PDF	6,500 In-stock	Get Quote
	960-23-12-D-AB-0	Wakefield Thermal	HEATSINK 23X12MM DIA PUSH PIN	1	PDF	6,500 In-stock	Get Quote
	960-23-12-S-AB-0	Wakefield Thermal	HEATSINK 23X12MM SIDE PUSH PIN	400	PDF	6,500 In-stock	Get Quote

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