Material Finish:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
ATS-EXL73-300-R0 Advanced Thermal Solutions, Inc.
HEATSINK AL6063 300X45X10MM
1
299
In-stock
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HSB18-232310 CUI Devices
HEAT SINK, BGA, 23 X 23 X 10 MM
1
5,589
In-stock
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ATS-EXL73-1220-R0 Advanced Thermal Solutions, Inc.
HEATSINK AL6063 1220X45X10MM
1
6
In-stock
Get Quote
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