- Manufacturer：
-
- Cooling Source (1)
- CUI Devices (1)
- Attachment Method：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Type：
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| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Cooling Source | 1 |
32
In-stock
|
Get Quote | |||
|
|
CUI Devices | 8,000 |
6,500
In-stock
|
Get Quote |