Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSS09-B20-P431 CUI Devices
HEAT SINK, STAMPING, TO-220, 29.
1
2,870
In-stock
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HSS13-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-220, 31
1
646
In-stock
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