- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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10 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Advanced Thermal Solutions, Inc. | 1 |
104
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
2,893
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
243
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 1 |
444
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 1 |
66
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
3
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
20
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 10 |
6,500
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
23
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 1 |
5
In-stock
|
Get Quote |