Attachment Method:
Material:
Material Finish:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSS-C2591-SMT-TR CUI Devices
HEAT SINK TO-263 COPPER
9,000
6,500
In-stock
Get Quote
6-1542000-2 TE Connectivity AMP Connectors
HS ASSY CLIP
1
6,500
In-stock
Get Quote
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