- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Advanced Thermal Solutions, Inc. | 1 |
1,023
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
1,485
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
9,688
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
2,987
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
1,224
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
291
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
60
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 10 |
6,500
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 10 |
6,500
In-stock
|
Get Quote |