- Manufacturer:
-
- CUI Devices (3)
- Attachment Method:
-
- Material:
-
- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
CUI Devices | 1 |
3,000
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
1,577
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
1,582
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
65
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
72
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
37
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 10 |
6,500
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 10 |
6,500
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 10 |
6,500
In-stock
|
Get Quote |