Image Part Manufacturer Description MOQ Stock Action
HSB10-232306 CUI Devices
HEAT SINK, BGA, 23 X 23 X 6 MM
1
1,287
In-stock
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HSB03-121218 CUI Devices
HEAT SINK, BGA, 12 X 12 X 18 MM
1
1,689
In-stock
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ATS-1103-C1-R0 Advanced Thermal Solutions, Inc.
1/2 BRICK HEATSINK 61X58X6.1MM
1
29
In-stock
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