- Manufacturer:
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- CUI Devices (2)
- Attachment Method:
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- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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3 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
CUI Devices | 5,400 |
6,500
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1,500 |
6,500
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 180 |
6,500
In-stock
|
Get Quote |