- Manufacturer：
-
- CTS Corporation (2)
- CUI Devices (1)
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
3 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1,200 |
6,500
In-stock
|
Get Quote | |||
|
|
CTS Corporation | 300 |
6,500
In-stock
|
Get Quote | |||
|
|
CTS Corporation | 300 |
6,500
In-stock
|
Get Quote |