- Manufacturer:
-
- CTS Corporation (1)
- CUI Devices (1)
- Ohmite (1)
- Attachment Method:
-
- Material:
-
- Material Finish:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
10 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Advanced Thermal Solutions, Inc. | 1 |
9
In-stock
|
Get Quote | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
10
In-stock
|
Get Quote | |||
![]() |
CUI Devices | 1 |
6,500
In-stock
|
Get Quote | |||
![]() |
Ohmite | 5,600 |
6,500
In-stock
|
Get Quote | |||
![]() |
CTS Corporation | 300 |
6,500
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 270 |
6,500
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 270 |
6,500
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 270 |
6,500
In-stock
|
Get Quote | |||
![]() |
Wakefield Thermal | 270 |
6,500
In-stock
|
Get Quote | |||
![]() |
TE Connectivity AMP Connectors | 1 |
6,500
In-stock
|
Get Quote |