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Fans, Thermal Management
Thermal - Heat Sinks
Package Cooled：
BGA
(1)
BGA, FPGA
(1)
Power Dissipation @ Temperature Rise：
1.5W @ 50°C
(1)
3.0W @ 50°C
(1)
Thermal Resistance @ Forced Air Flow：
5.20°C/W @ 200 LFM
(1)
6.00°C/W @ 500 LFM
(1)
Thermal Resistance @ Natural：
15.30°C/W
(1)
30.60°C/W
(1)
Type：
Board Level
(1)
Top Mount
(1)
Filter：
Thermal - Heat Sinks
Attachment Method : Solder Anchor
2 Records
Image
Part
Manufacturer
Description
MOQ
Stock
Action
374324B60023G
Aavid
BGA HEAT SINK
1
PDF
4,302
In-stock
Get Quote
374724B60024G
Aavid
HEATSINK BGA W/O SOLDER ANCHORS
1
PDF
1,134
In-stock
Get Quote
374324B60023G
Aavid
BGA HEAT SINK
Stock : 4,302
RFQ
374724B60024G
Aavid
HEATSINK BGA W/O SOLDER ANCHORS
Stock : 1,134
RFQ
1 / 1 Page, 2 Records
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