Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE01-193175P CUI Devices
HEAT SINK, EXTRUSION, 19 X 31.5
1
1,582
In-stock
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ATS-55450D-C1-R0 Advanced Thermal Solutions, Inc.
HEAT SINK 45MM X 45MM X 9.5MM
1
65
In-stock
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ATS-55190R-C1-R0 Advanced Thermal Solutions, Inc.
HEAT SINK 19MM X 19MM X 19.5MM
1
72
In-stock
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ATS-55425D-C1-R0 Advanced Thermal Solutions, Inc.
HEAT SINK 42.5 X 42.5 X 9.5MM
1
37
In-stock
Get Quote
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