Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
BGAH190-090E Ohmite
BGA HEATSINK W/TAPE
1
221
In-stock
Get Quote
BGAH150-075E Ohmite
BGA HEATSINK W/TAPE
1
150
In-stock
Get Quote
BGAH150-125E Ohmite
BGA HEATSINK W/TAPE
1
167
In-stock
Get Quote
BGAH375-125E Ohmite
BGA HEATSINK W/TAPE
1
520
In-stock
Get Quote
HSE01-193175P CUI Devices
HEAT SINK, EXTRUSION, 19 X 31.5
1
1,582
In-stock
Get Quote
HSE02-173213P CUI Devices
HEAT SINK, EXTRUSION, 17 X 31.9
1
1,572
In-stock
Get Quote
BGAH450-125E Ohmite
BGA HEATSINK W/TAPE
1
98
In-stock
Get Quote
BGAH425-125E Ohmite
BGA HEATSINK W/TAPE
1
42
In-stock
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BGAH270-175E Ohmite
BGA HEATSINK W/TAPE
1
46
In-stock
Get Quote
BGAH310-075E Ohmite
BGA HEATSINK W/TAPE
1
27
In-stock
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BGAH170-075E Ohmite
BGA HEATSINK W/TAPE
1
6,500
In-stock
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BGAH325-075E Ohmite
BGA HEATSINK W/TAPE
1
2
In-stock
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V2198N1-F ASSMANN WSW Components
HEATSINK CPU W/ADHESIVE STAMPED
528
6,500
In-stock
Get Quote
V2199N1-F ASSMANN WSW Components
HEATSINK CPU W/ADHESIVE STAMPED
1,092
6,500
In-stock
Get Quote
V2200N1-F ASSMANN WSW Components
HEATSINK CPU W/ADHESIVE STAMPED
528
6,500
In-stock
Get Quote
V2136N1-F ASSMANN WSW Components
HEATSINK CPU W/ADHESIVE STAMPED
606
6,500
In-stock
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V2136N1-F-LP ASSMANN WSW Components
HEATSINK CPU W/ADHESIVE STAMPED
606
6,500
In-stock
Get Quote
V2201N1-F ASSMANN WSW Components
HEATSINK CPU W/ADHESIVE STAMPED
480
6,500
In-stock
Get Quote
V2200N1-F-LP ASSMANN WSW Components
HEATSINK CPU W/ADHESIVE STAMPED
528
6,500
In-stock
Get Quote
V2201N1-F-LP ASSMANN WSW Components
HEATSINK CPU W/ADHESIVE STAMPED
480
6,500
In-stock
Get Quote
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