Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE02-173213 CUI Devices
HEAT SINK, EXTRUSION, 17 X 31.9
1
1,542
In-stock
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ATS-52230G-C0-R0 Advanced Thermal Solutions, Inc.
HEATSINK 23X23X12.5MM W/OUT TIM
1
6,500
In-stock
Get Quote
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