- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
3 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1 |
1,957
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
1,740
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
433
In-stock
|
Get Quote |