Power Dissipation @ Temperature Rise:
Product Status:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
173 Records
Image Part Manufacturer Description MOQ Stock Action
HSS19-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
1
2,987
In-stock
Get Quote
HSS20-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
1
2,355
In-stock
Get Quote
HSS23-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
1
2,657
In-stock
Get Quote
HSS05-C20-SMT-TR CUI Devices
HEAT SINK, STAMPING, TO-220, 12.
1
1,957
In-stock
Get Quote
HSB24-252510 CUI Devices
HEAT SINK, BGA,25 X 25 X 10 MM
1
1,358
In-stock
Get Quote
HSS26-B20-P38 CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
1
3,000
In-stock
Get Quote
HSE04-251265-2 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
2,577
In-stock
Get Quote
HSE04-251265-1 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
2,713
In-stock
Get Quote
HSS09-B20-P431 CUI Devices
HEAT SINK, STAMPING, TO-220, 29.
1
2,870
In-stock
Get Quote
HSS27-B20-P43 CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
1
2,500
In-stock
Get Quote
HSS24-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
1
2,992
In-stock
Get Quote
HSS11-B20-P38 CUI Devices
HEAT SINK, STAMPING, TO-220, 50.
1
2,215
In-stock
Get Quote
HSS15-B20-P40 CUI Devices
HEAT SINK, STAMPING, TO-220, 23.
1
4,828
In-stock
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HSB26-343408 CUI Devices
HEAT SINK, BGA, 33.5 X 33.5 X 8
1
1,194
In-stock
Get Quote
HSS02-B20-P318 CUI Devices
HEAT SINK, STAMPING, TO-220, 23.
1
1,606
In-stock
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HSS04-B20-P318 CUI Devices
HEAT SINK, STAMPING, TO-220, 41.
1
1,977
In-stock
Get Quote
HSB25-282810 CUI Devices
HEAT SINK, BGA, 28.5 X 28.5 X 10
1
1,704
In-stock
Get Quote
HSE01-193175 CUI Devices
HEAT SINK, EXTRUSION, 19 X 31.5
1
1,577
In-stock
Get Quote
HSS07-C20-P274 CUI Devices
HEAT SINK, STAMPING, TO-220, 21.
1
1,740
In-stock
Get Quote
HSB23-232325 CUI Devices
HEAT SINK, BGA, 23 X 23 X 25 MM
1
1,202
In-stock
Get Quote
2 / 9 Page, 173 Records