Power Dissipation @ Temperature Rise:
Product Status:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
173 Records
Image Part Manufacturer Description MOQ Stock Action
HSE05-171933 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
3,230
In-stock
Get Quote
HSE02-173213 CUI Devices
HEAT SINK, EXTRUSION, 17 X 31.9
1
1,542
In-stock
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HSE01-193175P CUI Devices
HEAT SINK, EXTRUSION, 19 X 31.5
1
1,582
In-stock
Get Quote
HSB30-373710 CUI Devices
HEAT SINK, BGA, 37.4 X 37 X 10 M
1
665
In-stock
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HSE06-503045 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
1,197
In-stock
Get Quote
HSE08-505028 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
1,118
In-stock
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HSB27-434316 CUI Devices
HEAT SINK, BGA, 43.1 X 43.1 X 16
1
1,081
In-stock
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HSE02-173213P CUI Devices
HEAT SINK, EXTRUSION, 17 X 31.9
1
1,572
In-stock
Get Quote
HSE07-753045 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
992
In-stock
Get Quote
HSE09-755028 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
999
In-stock
Get Quote
HSB28-606022 CUI Devices
HEAT SINK, BGA, 60 X 60 X 22 MM,
1
223
In-stock
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HSS-B20-CP-01 CUI Devices
HEATSINK TO-220 2.6W ALUMINUM
1
545
In-stock
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HSE-B20250-040H-01 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
1
605
In-stock
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HSE-B20254-035H CUI Devices
HEAT SINK, EXTRUSION, TO-220,25.
1
960
In-stock
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HSB06-181810 CUI Devices
HEAT SINK, BGA, 18 X 18 X 10 MM
1
780
In-stock
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HSS13-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-220, 31
1
646
In-stock
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HSB14-353518 CUI Devices
HEAT SINK, BGA, 35 X 35 X 18 MM
1
700
In-stock
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HSB19-272718 CUI Devices
HEAT SINK, BGA, 27 X 27 X 18 MM
1
239
In-stock
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HSS-B20-NPR-02 CUI Devices
HEATSINK TO-220 5.1W ALUMINUM
1
712
In-stock
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HSE-B254-045H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
1
703
In-stock
Get Quote
3 / 9 Page, 173 Records