Power Dissipation @ Temperature Rise:
Product Status:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
173 Records
Image Part Manufacturer Description MOQ Stock Action
HSS-C2540-SMT-TR CUI Devices
HEAT SINK TO-263 COPPER
150
300
In-stock
Get Quote
HSS-B20-0953H-02 CUI Devices
HEATSINK TO-220 2.9W ALUMINUM
1
315
In-stock
Get Quote
HSS-B20-061H-02 CUI Devices
HEATSINK TO-220 2.9W ALUMINUM
1
214
In-stock
Get Quote
HSS-B20-NP-07 CUI Devices
HEATSINK TO-220 2.3W ALUMINUM
1
129
In-stock
Get Quote
HSS-B20-0635H-02 CUI Devices
HEATSINK TO-220 2.6W ALUMINUM
1
415
In-stock
Get Quote
HSS-B20-NP-10 CUI Devices
HEATSINK TO-220 2.9W ALUMINUM
1
283
In-stock
Get Quote
HSS-B20-NPR-01 CUI Devices
HEATSINK TO-220 4.2W ALUMINUM
1
166
In-stock
Get Quote
HSS-B20-NPS-02 CUI Devices
HEATSINK TO-220 5.1W ALUMINUM
1
117
In-stock
Get Quote
HSS-B20-NPS-01 CUI Devices
HEATSINK TO-220 4.2W ALUMINUM
1
323
In-stock
Get Quote
HSS-B20-095H CUI Devices
HEATSINK TO-220 4.1W ALUMINUM
1
333
In-stock
Get Quote
HSS-B20-0508H-01S CUI Devices
HEATSINK TO-220 4.7W ALUMINUM
1
750
In-stock
Get Quote
HSS-B20-NP-15 CUI Devices
HEATSINK TO-220 4.1W ALUMINUM
1
376
In-stock
Get Quote
HSE-B18254-035H CUI Devices
HEAT SINK, EXTRUSION, TO-218, 25
1
610
In-stock
Get Quote
HSB13-303014 CUI Devices
HEAT SINK, BGA, 30.7 X 30.7 X 14
1
524
In-stock
Get Quote
HSS06-C20-P32 CUI Devices
HEAT SINK, STAMPING, TO-220, 27.
1
433
In-stock
Get Quote
HSS08-B18-CP CUI Devices
HEAT SINK, STAMPING, TO-218, 44.
1
990
In-stock
Get Quote
HSB08-212106 CUI Devices
HEAT SINK, BGA, 21 X 21 X 6 MM
1
6,500
In-stock
Get Quote
HSB09-212115 CUI Devices
HEAT SINK, BGA, 21 X 21 X 15 MM
1
6,500
In-stock
Get Quote
HSB05-171711 CUI Devices
HEAT SINK, BGA, 17 X 17 X 11.5 M
1
6,500
In-stock
Get Quote
HSE-B20250-045H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 50
1
14
In-stock
Get Quote
4 / 9 Page, 173 Records