Power Dissipation @ Temperature Rise:
Product Status:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
173 Records
Image Part Manufacturer Description MOQ Stock Action
HSB21-454515 CUI Devices
HEAT SINK, BGA, 45 X 45 X 15 MM
1
6,500
In-stock
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HSS-B20-NP-06 CUI Devices
HEATSINK TO-220 2.9W ALUMINUM
1
6,500
In-stock
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HSS-B20-0635H CUI Devices
HEATSINK TO-220 2.6W ALUMINUM
1
19
In-stock
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HSS-B20-061H-03 CUI Devices
HEATSINK TO-220 2.9W ALUMINUM
55
6,500
In-stock
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HSS-B20-NP-04 CUI Devices
HEATSINK TO-220 6.5W ALUMINUM
1
6,500
In-stock
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HSS-B20-0508H-01R CUI Devices
HEATSINK TO-220 4.7W ALUMINUM
65
6,500
In-stock
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HSS-B20-0953H-01 CUI Devices
HEATSINK TO-220 2.3W ALUMINUM
128
6,500
In-stock
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HSB01-080808 CUI Devices
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
1
6,500
In-stock
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HSS-B20-NP CUI Devices
HEATSINK TO-220 4W ALUMINUM
1
72
In-stock
Get Quote
HSS-B20-065V CUI Devices
HEATSINK TO-220 4W ALUMINUM
1
6,500
In-stock
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HSS14-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-220, 19.
1
6,500
In-stock
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HSB04-171706 CUI Devices
HEAT SINK, BGA, 17 X 17 X 6 MM
1
6,500
In-stock
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HSS-B20-053H-01 CUI Devices
HEATSINK TO-220 4.8W ALUMINUM
1
6,500
In-stock
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HSB07-202009 CUI Devices
HEAT SINK, BGA, 20 X 20 X 9 MM
1
6,500
In-stock
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HSS-B20-0503H CUI Devices
HEATSINK TO-220 4.6W ALUMINUM
1
6,500
In-stock
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HSE-B20350-NP CUI Devices
HEAT SINK, EXTRUSION, TO-220, 35
1
6,500
In-stock
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HSE-B254-04H CUI Devices
HEAT SINK, EXTRUSION, TO-220/TO-
1
6,500
In-stock
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HSE-B20380-040H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 38
1
6,500
In-stock
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HSE-B20254-035H-01 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
1
6,500
In-stock
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HSE-B20381-035H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 38
1
6,500
In-stock
Get Quote
5 / 9 Page, 173 Records