Backing, Carrier:
Thermal Conductivity:
Image Part Manufacturer Description MOQ Stock Action
PCS05-SF.20-TC3.0 Timtel Thermal
FIBERGLASS SUPPORTED SILICONE FI
1
18
In-stock
Get Quote
PCS07-SG.50-TC1.5 Timtel Thermal
SOFT SILICONE GAP PAD
1
10
In-stock
Get Quote
PCS11-SG.50-TC3.0S-A1 Timtel Thermal
ULTRA SOFT SILICONE GAP PAD
1
10
In-stock
Get Quote
PCS06-SF.20-TC3.0-SIL1 Timtel Thermal
FIBERGLASS SUPPORTED SILICONE FI
1
11
In-stock
Get Quote
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