Thermal Conductivity:
Image Part Manufacturer Description MOQ Stock Action
SF400-265005 CUI Devices
THERM PAD 26.25MMX50MM 1 SH=64PC
1
1
In-stock
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SF600-265005 CUI Devices
THERMAL INTERFACE MATERIAL, SF60
12
6,500
In-stock
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SF600G-265005 CUI Devices
THERMAL INTERFACE MATERIAL, SF60
9
6,500
In-stock
Get Quote
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