Thermal Conductivity:
Image Part Manufacturer Description MOQ Stock Action
SF100-265005 CUI Devices
THERM PAD 26.25MMX50MM 1 SH=56PC
1
13
In-stock
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SF100S-265005 CUI Devices
THERMAL INTERFACE MATERIAL, SF10
79
6,500
In-stock
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SF500-265005 CUI Devices
THERMAL INTERFACE MATERIAL, SF50
21
6,500
In-stock
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SF500G-265005 CUI Devices
THERMAL INTERFACE MATERIAL, SF50
15
6,500
In-stock
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