Thermal Conductivity:
Image Part Manufacturer Description MOQ Stock Action
SF100-313005 CUI Devices
THERM PAD 30MMX31.25MM 1 SH=72PC
1
3
In-stock
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SF100S-313005 CUI Devices
THERMAL INTERFACE MATERIAL, SF10
87
6,500
In-stock
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SF500-313005 CUI Devices
THERMAL INTERFACE MATERIAL, SF50
23
6,500
In-stock
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SF500G-313005 CUI Devices
THERMAL INTERFACE MATERIAL, SF50
16
6,500
In-stock
Get Quote
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