Thermal Conductivity:
Image Part Manufacturer Description MOQ Stock Action
AF100-313005 CUI Devices
THERM PAD 30MMX31.25MM 1 SH=78PC
1
17
In-stock
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AF500-313005 CUI Devices
THERM PAD 30MMX31.25MM 1SH=78PC
1
4
In-stock
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AF200-313005 CUI Devices
THERMAL INTERFACE MATERIAL, AF20
32
6,500
In-stock
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